In the manufacturing of quantum computers, an ultra-clean tungsten steel cutting blade is used to cut sealing gaskets for cryogenic packaging chambers.

Its surface undergoes plasma polishing, reducing particle shedding to below 0.001% and preventing microscopic dust from interfering with qubits.

Testing shows that the packaging yield has increased to 99.2%. As engineers noted, "In the quantum world, even the cleanliness of a single cut determines success or failure."

Precision manufacturing has entered the atomic era.