In December 2025, an intelligent blade sharpening platform integrating high-frequency ultrasonic vibration successfully produced nanometer-sharp tungsten carbide cutting blades.

The edge radius was consistently controlled to within 0.5 μm. When dicing 200 μm-thick silicon photonics wafers, chipping width was ≤10 μm and wafer breakage rate was as low as 0.08%.

This level of precision meets the stringent requirements of IMEC’s silicon photonics integration processes, filling a critical gap in domestically developed high-end dicing tools—while costing only 55% of comparable imported products.